Wireless RF data communications using 60 GHz antennas in multi-core systems

Ho Hsin Yeh, Nobuki Hiramatsu, Kathleen L. Melde

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

Free space wireless transmission via the 60 GHz antenna in the Multi-Chip Multi-Core (MCMC) architecture is proposed in this paper. Antenna in package (AiP) solution is chosen as the 60GHz antenna configuration and the antenna is designed based on low temperature co-fired ceramic (LTCC) superstrate that could connect to the silicon circuitry via the flip-chip technology. The designed antenna having ground shielded structures and the artificial magnetic conductor (AMC) will demonstrate the azimuth plane signal transmission with the high radiation efficiency.

Original languageEnglish (US)
Title of host publication2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Pages31-34
Number of pages4
DOIs
StatePublished - 2011
Event2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 - San Jose, CA, United States
Duration: Oct 23 2011Oct 26 2011

Publication series

Name2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011

Other

Other2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Country/TerritoryUnited States
CitySan Jose, CA
Period10/23/1110/26/11

Keywords

  • antenna radiation patterns
  • artificial magnetic conductor (AMC)
  • impedance matching
  • multi-chip mulii-core(MCMC)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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