Abstract
Wire sweep has been recognized as a critical process defect which can result in device failure. The phenomenon is very complicated as it is sensitive to a large number of parameters. In this experitnental work, the influence of some of the more important factors is investigated. These fxirameters include fluid-flow speed, wire-bond density, mold cavity height, and mold vent size. A 160L QFP package bonded with gold wires in a transparent mold is used as the test vehicle.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 137-142 |
| Number of pages | 6 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 121 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 1999 |
| Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering