Unified constitutive modelling of interfaces and materials in semiconductor devices

Engineering

• Unified Constitutive Modeling 100%
• Hardening Response 50%
• Strain History 50%
• Reference Model 50%
• Surface Plasticity 50%
• Thermomechanical Loads 50%

Keyphrases

• Preliminary Verification 50%
• Low Cycle Fatigue Life Prediction 50%
• Strain Damage 50%
• Surface Plasticity 50%
• Hardening Response 50%
• Stress-strain History 50%
• Incremental Constitutive Equations 50%

Material Science

• Thermomechanical Loads 50%
• Low-Cycle Fatigue 50%