Understanding the Reasons behind Defect Levels in Post-Copper-CMP Cleaning Processes with Different Chemistries and PVA Brushes

Y. Sampurno, A. Philipossian, A. N. Linhart, K. M. Wortman-Otto, W. T. Tseng, D. Tamboli, J. J. Keleher

Research output: Contribution to journal › Article › peer-review

1 Scopus citations

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Keyphrases

Engineering

Material Science

Chemical Engineering