Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

L. Jiang; J. M. Koo; S. Zeng; J. C. Mikkelsen; L. Zhang; P. Zhou; J. G. Santiago; T. W. Kenny; K. E. Goodson

Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

L. Jiang, J. M. Koo, S. Zeng, J. C. Mikkelsen, L. Zhang, P. Zhou, J. G. Santiago, T. W. Kenny, K. E. Goodson

Research output: Contribution to journal › Conference article › peer-review

Abstract

The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm × 1.2 cm silicon thermal test chip under an open-loop operation with a water flowrate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the operating pressure of the working fluid are expected to lower the resistance below 0.25 K/W.

Original language	English (US)
Pages (from-to)	153-157
Number of pages	5
Journal	Annual IEEE Semiconductor Thermal Measurement and Management Symposium
State	Published - 2001
Externally published	Yes
Event	17th Annual IEEE Semiconductor Thermal Measurement Symposium - San Jose, CA, United States Duration: Mar 20 2001 → Mar 22 2001

Keywords

Elelectrokinetic pump
IC cooling technology
Microchannel heat sinks
Two-phase heat transfer

ASJC Scopus subject areas

Instrumentation
Electrical and Electronic Engineering

Cite this

@article{32a644724b3a4f31a234b80fc1cdb458,

title = "Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system",

abstract = "The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm × 1.2 cm silicon thermal test chip under an open-loop operation with a water flowrate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the operating pressure of the working fluid are expected to lower the resistance below 0.25 K/W.",

keywords = "Elelectrokinetic pump, IC cooling technology, Microchannel heat sinks, Two-phase heat transfer",

author = "L. Jiang and Koo, {J. M.} and S. Zeng and Mikkelsen, {J. C.} and L. Zhang and P. Zhou and Santiago, {J. G.} and Kenny, {T. W.} and Goodson, {K. E.}",

year = "2001",

language = "English (US)",

pages = "153--157",

journal = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

issn = "1065-2221",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "17th Annual IEEE Semiconductor Thermal Measurement Symposium ; Conference date: 20-03-2001 Through 22-03-2001",

}

TY - JOUR

T1 - Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

AU - Jiang, L.

AU - Koo, J. M.

AU - Zeng, S.

AU - Mikkelsen, J. C.

AU - Zhang, L.

AU - Zhou, P.

AU - Santiago, J. G.

AU - Kenny, T. W.

AU - Goodson, K. E.

PY - 2001

Y1 - 2001

N2 - The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm × 1.2 cm silicon thermal test chip under an open-loop operation with a water flowrate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the operating pressure of the working fluid are expected to lower the resistance below 0.25 K/W.

AB - The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm × 1.2 cm silicon thermal test chip under an open-loop operation with a water flowrate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the operating pressure of the working fluid are expected to lower the resistance below 0.25 K/W.

KW - Elelectrokinetic pump

KW - IC cooling technology

KW - Microchannel heat sinks

KW - Two-phase heat transfer

UR - http://www.scopus.com/inward/record.url?scp=0035020722&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035020722&partnerID=8YFLogxK

M3 - Conference article

AN - SCOPUS:0035020722

SN - 1065-2221

SP - 153

EP - 157

JO - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

JF - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

T2 - 17th Annual IEEE Semiconductor Thermal Measurement Symposium

Y2 - 20 March 2001 through 22 March 2001

ER -

Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

Abstract

Keywords

ASJC Scopus subject areas

Other files and links

Fingerprint

Cite this