Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system

L. Jiang, J. M. Koo, S. Zeng, J. C. Mikkelsen, L. Zhang, P. Zhou, J. G. Santiago, T. W. Kenny, K. E. Goodson

Research output: Contribution to journalConference articlepeer-review

35 Scopus citations


The trend towards higher speed and greater integration of modern ICs requires improved cooling technology. This paper describes the design and characterization of a two-phase microchannel heat sink in an electrokinetic VLSI chip cooling system. The heat sink achieves a thermal resistance of 1 K/W for a 1.2 cm × 1.2 cm silicon thermal test chip under an open-loop operation with a water flowrate of 5 ml/min. Preliminary tests show that a closed-loop EK-pumped system running at 1.2 ml/min and 12 psi removes 17.3 W, with heat rejection at an aluminum fin array. Further optimization of the microchannel dimensions and the operating pressure of the working fluid are expected to lower the resistance below 0.25 K/W.

Original languageEnglish (US)
Pages (from-to)153-157
Number of pages5
JournalAnnual IEEE Semiconductor Thermal Measurement and Management Symposium
StatePublished - 2001
Externally publishedYes
Event17th Annual IEEE Semiconductor Thermal Measurement Symposium - San Jose, CA, United States
Duration: Mar 20 2001Mar 22 2001


  • Elelectrokinetic pump
  • IC cooling technology
  • Microchannel heat sinks
  • Two-phase heat transfer

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering


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