Tribology and Removal Rate Characteristics of Abrasive-Free Slurries for Copper CMP Applications

Darren DeNardis, Jamshid Sorooshian, Masanobu Habiro, Chris Rogers, Ara Philipossian

Research output: Contribution to journalArticlepeer-review

40 Scopus citations


This study employs real-time high-frequency frictional force analysis coupled with removal rate studies to quantify the extent of frictional forces encountered during copper polish using abrasive-free slurries and to establish the time-dependent tribological attributes of the process. The study also uses spectral analysis of the frictional force data to validate and explore the subtle characteristics of the formation and extinction of the copper complex layer known to play an integral role in abrasive-free copper chemical mechanical planarization (CMP). It was found that copper removal rates are at least partially driven by coefficient of friction, which is similar to the case of interlayer dielectric (ILD) CMP. Spectral analysis suggests that the periodicity of the copper complex layer formation and abrasion is approximately 10ms.

Original languageEnglish (US)
Pages (from-to)6809-6814
Number of pages6
JournalJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Issue number11
StatePublished - Nov 2003


  • Abrasive-free CMP
  • Chemical mechanical planarization (CMP)
  • Copper CMP
  • Fourier transform spectral analysis

ASJC Scopus subject areas

  • General Engineering
  • General Physics and Astronomy


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