Tribological, Thermal and Kinetic Characterization of SiO2 and Si3N4 Polishing for STI CMP on Blanket and Patterned Wafers

Juan Cristobal Mariscal, Jeffrey McAllister, Yasa Sampurno, Jon Sierra Suarez, Mark O'Neill, Hongjun Zhou, Malcolm Grief, Dave Slutz, Ara Philipossian

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Engineering & Materials Science

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