Fingerprint
Dive into the research topics of 'Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Tribological, thermal, and kinetic characterization of 300-mm copper chemical mechanical planarization process
Yubo Jiao, Yasa Adi Sampurno, Yun Zhuang, Xiaomin Wei, Anand Meled, Ara Philipossian
Research output: Contribution to journal › Article › peer-review
18
Scopus
citations