Abstract
A novel PVA brush scrubber is constructed for studying the tribology of post-CMP cleaning processes using real-time coefficient of friction analysis. Results indicate that the tribological mechanism and the magnitude of the coefficient of friction strongly depend on a number of key factors such as tool kinematics, brush design, brush pressure and the pH of the cleaning fluid. Trends are qualitatively explained by considering brush deformation, liquid-wafer chemical interactions, tool kinematics, fluid dynamics, and frequency analysis of the friction signal.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 275-280 |
| Number of pages | 6 |
| Journal | Solid State Phenomena |
| Volume | 92 |
| State | Published - 2003 |
| Externally published | Yes |
| Event | The International Symposium on Ultra Clean Processing of Silicon Surfaces V - Ostend, Belgium Duration: Sep 16 2002 → Sep 18 2002 |
Keywords
- Brush scrubbing
- Coefficient of friction
- PVA
- Post-CMP cleaning
- Tribology
ASJC Scopus subject areas
- Atomic and Molecular Physics, and Optics
- General Materials Science
- Condensed Matter Physics