Tribological and kinetic characterization of 300-mm copper chemical mechanical planarization process

Z. Han, Y. Zhuang, Y. Sampurno, A. Meled, Y. Jiao, X. Wei, J. Cheng, M. Moinpour, D. Hooper, A. Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

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Engineering & Materials Science