Towards a VLSI packaging design support environment (PDSE); Concepts and implementation

J. W. Rozenblit; J. L. Prince; O. A. Palusinski

Towards a VLSI packaging design support environment (PDSE); Concepts and implementation

J. W. Rozenblit, J. L. Prince, O. A. Palusinski

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A software shell for assisting in VLSI package design is discussed. Called packaging design support environment (PDSE), the shell integrates tools for modeling and simulation of electrical characteristics of VLSI packages. Parameter extractors tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with loss dielectrics. The simulation tools compute pulse response characteristics of uniform, multiple, coupled, and lossless transmission lines. The PDSE shell provides facilities for supporting the package design cycle. Such support facilities include an interface to couple PDSE with a CAD design database, model and simulation experiment libraries, simulation management procedures that guide evaluation of alternative design models, and data analysis support tools. Expert systems techniques are being incorporated into PDSE.

Original language	English (US)
Title of host publication	Proceedings - IEEE International Conference on Computer Design
Subtitle of host publication	VLSI in Computers and Processors
Publisher	Publ by IEEE
Pages	443-448
Number of pages	6
ISBN (Print)	O81862079X
State	Published - Sep 1990
Event	Proceedings of the 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors - ICCD '90 - Cambridge, MA, USA Duration: Sep 17 1990 → Sep 19 1990

Publication series

Name	Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

Other

Other	Proceedings of the 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors - ICCD '90
City	Cambridge, MA, USA
Period	9/17/90 → 9/19/90

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

Rozenblit, J. W., Prince, J. L., & Palusinski, O. A. (1990). Towards a VLSI packaging design support environment (PDSE); Concepts and implementation. In Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors (pp. 443-448). (Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors). Publ by IEEE.

Towards a VLSI packaging design support environment (PDSE); Concepts and implementation. / Rozenblit, J. W.; Prince, J. L.; Palusinski, O. A.
Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. Publ by IEEE, 1990. p. 443-448 (Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Rozenblit, JW, Prince, JL & Palusinski, OA 1990, Towards a VLSI packaging design support environment (PDSE); Concepts and implementation. in Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors, Publ by IEEE, pp. 443-448, Proceedings of the 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors - ICCD '90, Cambridge, MA, USA, 9/17/90.

Rozenblit, J. W. ; Prince, J. L. ; Palusinski, O. A. / Towards a VLSI packaging design support environment (PDSE); Concepts and implementation. Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors. Publ by IEEE, 1990. pp. 443-448 (Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors).

@inproceedings{cf30860dcc394948ab7733f66fa2b765,

title = "Towards a VLSI packaging design support environment (PDSE); Concepts and implementation",

abstract = "A software shell for assisting in VLSI package design is discussed. Called packaging design support environment (PDSE), the shell integrates tools for modeling and simulation of electrical characteristics of VLSI packages. Parameter extractors tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with loss dielectrics. The simulation tools compute pulse response characteristics of uniform, multiple, coupled, and lossless transmission lines. The PDSE shell provides facilities for supporting the package design cycle. Such support facilities include an interface to couple PDSE with a CAD design database, model and simulation experiment libraries, simulation management procedures that guide evaluation of alternative design models, and data analysis support tools. Expert systems techniques are being incorporated into PDSE.",

author = "Rozenblit, {J. W.} and Prince, {J. L.} and Palusinski, {O. A.}",

year = "1990",

month = sep,

language = "English (US)",

isbn = "O81862079X",

series = "Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors",

publisher = "Publ by IEEE",

pages = "443--448",

booktitle = "Proceedings - IEEE International Conference on Computer Design",

note = "Proceedings of the 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors - ICCD '90 ; Conference date: 17-09-1990 Through 19-09-1990",

}

TY - GEN

T1 - Towards a VLSI packaging design support environment (PDSE); Concepts and implementation

AU - Rozenblit, J. W.

AU - Prince, J. L.

AU - Palusinski, O. A.

PY - 1990/9

Y1 - 1990/9

N2 - A software shell for assisting in VLSI package design is discussed. Called packaging design support environment (PDSE), the shell integrates tools for modeling and simulation of electrical characteristics of VLSI packages. Parameter extractors tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with loss dielectrics. The simulation tools compute pulse response characteristics of uniform, multiple, coupled, and lossless transmission lines. The PDSE shell provides facilities for supporting the package design cycle. Such support facilities include an interface to couple PDSE with a CAD design database, model and simulation experiment libraries, simulation management procedures that guide evaluation of alternative design models, and data analysis support tools. Expert systems techniques are being incorporated into PDSE.

AB - A software shell for assisting in VLSI package design is discussed. Called packaging design support environment (PDSE), the shell integrates tools for modeling and simulation of electrical characteristics of VLSI packages. Parameter extractors tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with loss dielectrics. The simulation tools compute pulse response characteristics of uniform, multiple, coupled, and lossless transmission lines. The PDSE shell provides facilities for supporting the package design cycle. Such support facilities include an interface to couple PDSE with a CAD design database, model and simulation experiment libraries, simulation management procedures that guide evaluation of alternative design models, and data analysis support tools. Expert systems techniques are being incorporated into PDSE.

UR - http://www.scopus.com/inward/record.url?scp=0025486885&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0025486885&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0025486885

SN - O81862079X

T3 - Proceedings - IEEE International Conference on Computer Design: VLSI in Computers and Processors

SP - 443

EP - 448

BT - Proceedings - IEEE International Conference on Computer Design

PB - Publ by IEEE

T2 - Proceedings of the 1990 IEEE International Conference on Computer Design: VLSI in Computers and Processors - ICCD '90

Y2 - 17 September 1990 through 19 September 1990

ER -

Towards a VLSI packaging design support environment (PDSE); Concepts and implementation

Abstract

Publication series

Other

ASJC Scopus subject areas

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