Thinned 4096×4096 CCD mosaic

Michael A. Damento; Shun Lo; Hans J. Meyer; Peter E. Doherty; Gary R. Sims; Michael P. Lesser

doi:10.1117/12.172760

Thinned 4096×4096 CCD mosaic

Michael A. Damento, Shun Lo, Hans J. Meyer, Peter E. Doherty, Gary R. Sims, Michael P. Lesser

Research output: Contribution to journal › Conference article › peer-review

2 Scopus citations

Abstract

A thinned CCD mosaic was fabricated from four Loral 2048x2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a "flip-chip" wire bonding technique followed by chemical dissolution of the glass support The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.

Original language	English (US)
Pages (from-to)	175-179
Number of pages	5
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	2172
DOIs	https://doi.org/10.1117/12.172760
State	Published - May 1 1994
Event	Charge-Coupled Devices and Solid State Optical Sensors IV 1994 - San Jose, United States Duration: Feb 6 1994 → Feb 10 1994

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Computer Science Applications
Applied Mathematics
Electrical and Electronic Engineering

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10.1117/12.172760

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title = "Thinned 4096×4096 CCD mosaic",

abstract = "A thinned CCD mosaic was fabricated from four Loral 2048x2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a {"}flip-chip{"} wire bonding technique followed by chemical dissolution of the glass support The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.",

author = "Damento, \{Michael A.\} and Shun Lo and Meyer, \{Hans J.\} and Doherty, \{Peter E.\} and Sims, \{Gary R.\} and Lesser, \{Michael P.\}",

year = "1994",

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doi = "10.1117/12.172760",

language = "English (US)",

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T1 - Thinned 4096×4096 CCD mosaic

AU - Damento, Michael A.

AU - Lo, Shun

AU - Meyer, Hans J.

AU - Doherty, Peter E.

AU - Sims, Gary R.

AU - Lesser, Michael P.

PY - 1994/5/1

Y1 - 1994/5/1

N2 - A thinned CCD mosaic was fabricated from four Loral 2048x2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a "flip-chip" wire bonding technique followed by chemical dissolution of the glass support The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.

AB - A thinned CCD mosaic was fabricated from four Loral 2048x2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a "flip-chip" wire bonding technique followed by chemical dissolution of the glass support The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.

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U2 - 10.1117/12.172760

DO - 10.1117/12.172760

M3 - Conference article

AN - SCOPUS:85076635679

SN - 0277-786X

VL - 2172

SP - 175

EP - 179

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

T2 - Charge-Coupled Devices and Solid State Optical Sensors IV 1994

Y2 - 6 February 1994 through 10 February 1994

ER -

Thinned 4096×4096 CCD mosaic

Abstract

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