Abstract
A thinned CCD mosaic was fabricated from four Loral 2048x2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a "flip-chip" wire bonding technique followed by chemical dissolution of the glass support The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.
Original language | English (US) |
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Pages (from-to) | 175-179 |
Number of pages | 5 |
Journal | Proceedings of SPIE - The International Society for Optical Engineering |
Volume | 2172 |
DOIs | |
State | Published - May 1 1994 |
Event | Charge-Coupled Devices and Solid State Optical Sensors IV 1994 - San Jose, United States Duration: Feb 6 1994 → Feb 10 1994 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Computer Science Applications
- Applied Mathematics
- Electrical and Electronic Engineering