Thinned 4096×4096 CCD mosaic

Michael A. Damento, Shun Lo, Hans J. Meyer, Peter E. Doherty, Gary R. Sims, Michael P. Lesser

Research output: Contribution to journalConference articlepeer-review

2 Scopus citations


A thinned CCD mosaic was fabricated from four Loral 2048x2048 edge-buttable CCDs. Thinning was performed on the whole wafer with subsequent dicing and handling facilitated by bonding the thinned wafer to a glass plate. Packaging of the devices involved a "flip-chip" wire bonding technique followed by chemical dissolution of the glass support The fabrication process was designed to minimize the gaps between devices and retain a high degree of flatness in the finished CCDs.

Original languageEnglish (US)
Pages (from-to)175-179
Number of pages5
JournalProceedings of SPIE - The International Society for Optical Engineering
StatePublished - May 1 1994
EventCharge-Coupled Devices and Solid State Optical Sensors IV 1994 - San Jose, United States
Duration: Feb 6 1994Feb 10 1994

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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