Abstract
This study presents a new semianalytical method for the thermoelastic bending analysis of laminated plates with an elliptical hole under a nonuniform through-the-thickness temperature distribution. This new method employs the principle of stationary potential energy in conjunction with the complex variable approach for approximating displacement and stress resultants that automatically satisfy both in-plane and bending equilibrium equations. The numerical results demonstrate the influence of the material layup, uniform and nonuniform temperature distribution, and the cutout shape and its orientation on the thermal bending of flat laminates.
Original language | English (US) |
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Pages (from-to) | 1-31 |
Number of pages | 31 |
Journal | Journal of Thermal Stresses |
Volume | 27 |
Issue number | 1 |
DOIs | |
State | Published - Jan 2004 |
Keywords
- Cutout
- Laminated plate
- Nonuniform temperature
- Semianalytical
- Thermal stress
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics