Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 2-verification and application

C. Basaran; C. S. Desai; T. Kundu

doi:10.1115/1.2792285

Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 2-verification and application

C. Basaran, C. S. Desai, T. Kundu

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26 Scopus citations

Abstract

The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 eutectic solder alloy. This solder alloy is a commonly used interconnection material for surface mount technology packages. It is demonstrated that the proposed procedure provides highly satisfactory correlation with the observed laboratory behavior of materials and with test results for a chip-substrate system simulated in the laboratory.

Original language	English (US)
Pages (from-to)	48-53
Number of pages	6
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	120
Issue number	1
DOIs	https://doi.org/10.1115/1.2792285
State	Published - Mar 1998

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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abstract = "The finite element procedure with the unified disturbed state modeling concept presented in Part I, Basaran et al. (1998), is verified here with respect to laboratory test results for Pb40/Sn60 eutectic solder alloy. This solder alloy is a commonly used interconnection material for surface mount technology packages. It is demonstrated that the proposed procedure provides highly satisfactory correlation with the observed laboratory behavior of materials and with test results for a chip-substrate system simulated in the laboratory.",

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Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept: Part 2-verification and application

Abstract

ASJC Scopus subject areas

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