Thermal loading of a thin layer with circular debonding over a substrate

H. Balkan, E. Madenci

Research output: Contribution to journalArticlepeer-review

4 Scopus citations


By using techniques appropriate to mixed boundary value problems, this study addresses the determination of stress intensity factors for a circular interface debonding between a thin layer and a substrate subjected to nearly uniform temperature change. The solution method involves three-dimensional equilibrium equations of thermo-elasticity under axisymmetry conditions. The stress intensity factors are obtained by solving the resulting pair of coupled singular integral equations numerically.

Original languageEnglish (US)
Pages (from-to)217-231
Number of pages15
JournalInternational Journal of Fracture
Issue number3
StatePublished - 1998


  • Circular debonding
  • Dissimilar materials
  • Thermal loading

ASJC Scopus subject areas

  • Computational Mechanics
  • Modeling and Simulation
  • Mechanics of Materials


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