Thermal loading of a thin layer with circular debonding over a substrate

H. Balkan; E. Madenci

doi:10.1023/A:1007441514577

Thermal loading of a thin layer with circular debonding over a substrate

H. Balkan, E. Madenci

Aerospace and Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

4 Scopus citations

Abstract

By using techniques appropriate to mixed boundary value problems, this study addresses the determination of stress intensity factors for a circular interface debonding between a thin layer and a substrate subjected to nearly uniform temperature change. The solution method involves three-dimensional equilibrium equations of thermo-elasticity under axisymmetry conditions. The stress intensity factors are obtained by solving the resulting pair of coupled singular integral equations numerically.

Original language	English (US)
Pages (from-to)	217-231
Number of pages	15
Journal	International Journal of Fracture
Volume	91
Issue number	3
DOIs	https://doi.org/10.1023/A:1007441514577
State	Published - 1998

Keywords

Circular debonding
Dissimilar materials
Thermal loading

ASJC Scopus subject areas

Computational Mechanics
Modeling and Simulation
Mechanics of Materials

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10.1023/A:1007441514577

Cite this

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abstract = "By using techniques appropriate to mixed boundary value problems, this study addresses the determination of stress intensity factors for a circular interface debonding between a thin layer and a substrate subjected to nearly uniform temperature change. The solution method involves three-dimensional equilibrium equations of thermo-elasticity under axisymmetry conditions. The stress intensity factors are obtained by solving the resulting pair of coupled singular integral equations numerically.",

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AU - Balkan, H.

AU - Madenci, E.

PY - 1998

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N2 - By using techniques appropriate to mixed boundary value problems, this study addresses the determination of stress intensity factors for a circular interface debonding between a thin layer and a substrate subjected to nearly uniform temperature change. The solution method involves three-dimensional equilibrium equations of thermo-elasticity under axisymmetry conditions. The stress intensity factors are obtained by solving the resulting pair of coupled singular integral equations numerically.

AB - By using techniques appropriate to mixed boundary value problems, this study addresses the determination of stress intensity factors for a circular interface debonding between a thin layer and a substrate subjected to nearly uniform temperature change. The solution method involves three-dimensional equilibrium equations of thermo-elasticity under axisymmetry conditions. The stress intensity factors are obtained by solving the resulting pair of coupled singular integral equations numerically.

KW - Circular debonding

KW - Dissimilar materials

KW - Thermal loading

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DO - 10.1023/A:1007441514577

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JO - International Journal of Fracture

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ER -

Thermal loading of a thin layer with circular debonding over a substrate

Abstract

Keywords

ASJC Scopus subject areas

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