Abstract
The thermal conductivity of hypoeutectic Al-Cu alloys during solidification and cooling was estimated by combining available data on electrical resistivity and thermal conductivity. To estimate the thermal conductivity of the solid alloys, the Smith-Palmer equation was used. This equation enables one to closely estimate the thermal conductivities from known data on electrical conductivities. The electrical resistivities of Al-Cu melts were also gathered. The Smith-Palmer equation was tested successfully for pure Al-melt and assumed to apply to Al-Cu melts, so that their thermal conductivities - could be estimated. Finally simple-mixture models were applied to estimate the electrical resistivities and thermal conductivities of the alloys during solidification.
Original language | English (US) |
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Pages (from-to) | 48-52 |
Number of pages | 5 |
Journal | Materials Science and Engineering A |
Volume | 224 |
Issue number | 1-2 |
DOIs | |
State | Published - Mar 31 1997 |
Keywords
- Eutectic
- Temperature coefficient
- Thermal conductivity
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering