Testing and modeling of solders using new test device, part 2: Calibration and validation

Chandrakant S. Dosai; Zhichao Wang; Russell Whitenack; Tribikram Kundu

doi:10.1115/1.1756147

Testing and modeling of solders using new test device, part 2: Calibration and validation

Chandrakant S. Dosai, Zhichao Wang, Russell Whitenack, Tribikram Kundu

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

The determination of disturbed state concept (DSC) parameters by following different procedures was presented. It was found that some of the parameters were not significantly influenced by temperature and strain rates. The DSC model was used to predict typical stress-strain data and for a boundary value problem involving a thin small outline package (TSOP). The DCS model can provide a unified approach toward modeling the behavior including elastic, plastic and creep strains, and microcracking leading to fracture, softening and failure.

Original language	English (US)
Pages (from-to)	232-236
Number of pages	5
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	126
Issue number	2
DOIs	https://doi.org/10.1115/1.1756147
State	Published - Jun 2004

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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abstract = "The determination of disturbed state concept (DSC) parameters by following different procedures was presented. It was found that some of the parameters were not significantly influenced by temperature and strain rates. The DSC model was used to predict typical stress-strain data and for a boundary value problem involving a thin small outline package (TSOP). The DCS model can provide a unified approach toward modeling the behavior including elastic, plastic and creep strains, and microcracking leading to fracture, softening and failure.",

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AU - Whitenack, Russell

AU - Kundu, Tribikram

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Testing and modeling of solders using new test device, part 2: Calibration and validation

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