Testing and modeling of solders using new test device, part 1: Models and testing

The development and use of a new testing device called the thermomechanical-digital image correlation (TM-DIC), for testing and modeling of solders, was discussed. The TM-DIC device is capable of multidimensional (shear and normal) loading, temperature control (isothermal and thermomechanical), different rates of loading and creep at constant stress or displacement. The DIC provides advantages such as use of very small specimens and avoidance of grid attachment. The DIC is less robust than the foregoing methods and provides very good measurements to monitor strain, microcracking and fracture. The DIC software developed by K&T Measuring System, Germany has been integrated in TM-DIC.