Abstract
An interferometric surface profiler for high-magnification fixed through glass measurement (patent pending), such as for a packaged MEMS or MOEMS measurement, is described in this paper. Three techniques are introduced into the profiler, including aberration correction and long working distance for the objective, substantially shaped illumination and dispersive compensation. Measurement results illuminate that the data of the through glass objective are very close to those of the standard objective.
| Original language | English (US) |
|---|---|
| Article number | 24 |
| Pages (from-to) | 189-197 |
| Number of pages | 9 |
| Journal | Progress in Biomedical Optics and Imaging - Proceedings of SPIE |
| Volume | 5716 |
| DOIs | |
| State | Published - 2005 |
| Externally published | Yes |
| Event | Reliability, Packaging, Testing and Characterization of MEMS/MOEMS IV - San Jose, CA, United States Duration: Jan 24 2005 → Jan 25 2005 |
Keywords
- Interferometric profiler
- Packaged MEMS or MOEMs measurement
- Surface profiler
- Through glass measurement
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Biomaterials
- Radiology Nuclear Medicine and imaging