@inproceedings{6d9ddd2f969a42bea9953d6e943dbbde,
title = "Subsurface damage characterization with nonlinear high numerical microscopy",
abstract = "Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.",
author = "Phat Lu and Youngsik Kim and Milster, \{Tom D.\}",
year = "2014",
month = oct,
day = "14",
doi = "10.1364/fio.2014.jw3a.9",
language = "English (US)",
series = "Optics InfoBase Conference Papers",
publisher = "Optical Society of America (OSA)",
booktitle = "Optics InfoBase Conference Papers",
note = "Laser Science, LS 2014 ; Conference date: 19-10-2014 Through 23-10-2014",
}