Subsurface damage characterization with nonlinear high numerical microscopy

Phat Lu; Youngsik Kim; Tom D. Milster

doi:10.1364/fio.2014.jw3a.9

Subsurface damage characterization with nonlinear high numerical microscopy

Phat Lu, Youngsik Kim, Tom D. Milster

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.

Original language	English (US)
Title of host publication	Optics InfoBase Conference Papers
Publisher	Optical Society of America (OSA)
ISBN (Electronic)	1557522863
DOIs	https://doi.org/10.1364/fio.2014.jw3a.9
State	Published - Oct 14 2014
Event	Laser Science, LS 2014 - Tucson, United States Duration: Oct 19 2014 → Oct 23 2014

Publication series

Name	Optics InfoBase Conference Papers

Other

Other	Laser Science, LS 2014
Country/Territory	United States
City	Tucson
Period	10/19/14 → 10/23/14

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

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10.1364/fio.2014.jw3a.9

Cite this

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title = "Subsurface damage characterization with nonlinear high numerical microscopy",

abstract = "Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.",

author = "Phat Lu and Youngsik Kim and Milster, {Tom D.}",

year = "2014",

month = oct,

day = "14",

doi = "10.1364/fio.2014.jw3a.9",

language = "English (US)",

series = "Optics InfoBase Conference Papers",

publisher = "Optical Society of America (OSA)",

booktitle = "Optics InfoBase Conference Papers",

note = "Laser Science, LS 2014 ; Conference date: 19-10-2014 Through 23-10-2014",

}

TY - GEN

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AU - Lu, Phat

AU - Kim, Youngsik

AU - Milster, Tom D.

PY - 2014/10/14

Y1 - 2014/10/14

N2 - Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.

AB - Sub-surface damage characterization occurs in semiconductor device fabrication, like diamond turning and milling. Third harmonic generation (THG) microscopy can help to characterize subsurface damage, because nanometer sized asperities caused by defects amplify the THG signal.

UR - http://www.scopus.com/inward/record.url?scp=85088347907&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85088347907&partnerID=8YFLogxK

U2 - 10.1364/fio.2014.jw3a.9

DO - 10.1364/fio.2014.jw3a.9

M3 - Conference contribution

AN - SCOPUS:85088347907

T3 - Optics InfoBase Conference Papers

BT - Optics InfoBase Conference Papers

PB - Optical Society of America (OSA)

T2 - Laser Science, LS 2014

Y2 - 19 October 2014 through 23 October 2014

ER -

Subsurface damage characterization with nonlinear high numerical microscopy

Abstract

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Other

ASJC Scopus subject areas

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