Abstract
This research concerns itself with a stress and reliability analysis of electronic packages with ultra-thin chips based on the finite element method. The effect of chip and substrate thickness, substrate material, presence of underfill, dimensions, and shape of the bump on stress reduction is analyzed. Obtained results clearly show that chip thinning, when used with an appropriate design of the entire package, can significantly decrease stresses and stress intensity factors and improve the reliability of the package. The developed software provides an effective design tool to quantify the reliability, stresses, and deflections of a package with ultra-thin chips.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 98-103 |
| Number of pages | 6 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 125 |
| Issue number | 1 |
| DOIs | |
| State | Published - 2003 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering