The functionality of flexible electronics relies on stable performance of thin film micro-electrodes. This letter investigates the behavior of gold thin films on polyimide, a prevalent combination in flexible devices. The dynamic behavior of gold micro-electrodes has been studied by subjecting them to stress while monitoring their resistance in situ. The shape of the electrodes was systematically varied to examine resistive strain sensitivity, while an additional encapsulation was applied to characterize multilayer behavior. The realized designs show remarkable tolerance to repetitive strain, demonstrating that curvature and encapsulation are excellent approaches for minimizing resistive strain sensitivity to enable durable flexible electronics.
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)