Abstract
This study concerns the prediction of crack growth rate for solder joints in electronic packages under thermal cycling. The crack growth rate, which is dependent on the intrinsic solder property and the current stress state, is calculated based on the strain energy density criterion. The critical value of the strain energy density represents the intrinsic property of the solder. The comparison of the crack growth predictions with the experimental measurements demonstrates the applicability of the strain energy density criterion for the reliability life prediction of solder joints.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 398-405 |
| Number of pages | 8 |
| Journal | Journal of Electronic Packaging, Transactions of the ASME |
| Volume | 126 |
| Issue number | 3 |
| DOIs | |
| State | Published - Sep 2004 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Computer Science Applications
- Electrical and Electronic Engineering