Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices

Nicholas Rolston; Adam D. Printz; Florian Hilt; Michael Q. Hovish; Reinhold H. Dauskardt; Karsten Bruning; Christopher J. Tassone

doi:10.1109/IITC.2018.8430405

Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices

Nicholas Rolston, Adam D. Printz, Florian Hilt, Michael Q. Hovish, Reinhold H. Dauskardt, Karsten Bruning, Christopher J. Tassone

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

We report on submicron organosilicate barrier films produced rapidly in ambient by a scalable spray plasma process for improved solar cell stability. The plasma is at a sufficiently low temperature to be compatible with flexible electronic devices. The thickness of the barrier films is tunable and fully transparent over the visible spectrum. The morphology and density of the barrier are shown to improve with the addition of a fluorine-based precursor. Thin-film perovskite solar cells with submicron coatings exhibited significant improvements in stability when exposed to light, heat, and moisture. X-ray diffraction measurements performed while heating showed the barrier film dramatically slows the formation of PbI2. When deposited on a flexible substrate, the barrier films exhibit no signs of cracking or delamination after 10,000 bending cycles on a 127 μm substrate with a bending radius of 1 cm.

Original language	English (US)
Title of host publication	2018 IEEE International Interconnect Technology Conference, IITC 2018
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	138-140
Number of pages	3
ISBN (Print)	9781538643372
DOIs	https://doi.org/10.1109/IITC.2018.8430405
State	Published - Aug 8 2018
Externally published	Yes
Event	2018 IEEE International Interconnect Technology Conference, IITC 2018 - Santa Clara, United States Duration: Jun 4 2018 → Jun 7 2018

Publication series

Name	2018 IEEE International Interconnect Technology Conference, IITC 2018

Conference

Conference	2018 IEEE International Interconnect Technology Conference, IITC 2018
Country/Territory	United States
City	Santa Clara
Period	6/4/18 → 6/7/18

ASJC Scopus subject areas

Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials

Access to Document

10.1109/IITC.2018.8430405

Cite this

Rolston, N., Printz, A. D., Hilt, F., Hovish, M. Q., Dauskardt, R. H., Bruning, K., & Tassone, C. J. (2018). Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices. In 2018 IEEE International Interconnect Technology Conference, IITC 2018 (pp. 138-140). [8430405] (2018 IEEE International Interconnect Technology Conference, IITC 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IITC.2018.8430405

Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices. / Rolston, Nicholas; Printz, Adam D.; Hilt, Florian et al.
2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 138-140 8430405 (2018 IEEE International Interconnect Technology Conference, IITC 2018).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Rolston, N, Printz, AD, Hilt, F, Hovish, MQ, Dauskardt, RH, Bruning, K & Tassone, CJ 2018, Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices. in 2018 IEEE International Interconnect Technology Conference, IITC 2018., 8430405, 2018 IEEE International Interconnect Technology Conference, IITC 2018, Institute of Electrical and Electronics Engineers Inc., pp. 138-140, 2018 IEEE International Interconnect Technology Conference, IITC 2018, Santa Clara, United States, 6/4/18. https://doi.org/10.1109/IITC.2018.8430405

Rolston N, Printz AD, Hilt F, Hovish MQ, Dauskardt RH, Bruning K et al. Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices. In 2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc. 2018. p. 138-140. 8430405. (2018 IEEE International Interconnect Technology Conference, IITC 2018). doi: 10.1109/IITC.2018.8430405

Rolston, Nicholas ; Printz, Adam D. ; Hilt, Florian et al. / Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices. 2018 IEEE International Interconnect Technology Conference, IITC 2018. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 138-140 (2018 IEEE International Interconnect Technology Conference, IITC 2018).

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title = "Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices",

abstract = "We report on submicron organosilicate barrier films produced rapidly in ambient by a scalable spray plasma process for improved solar cell stability. The plasma is at a sufficiently low temperature to be compatible with flexible electronic devices. The thickness of the barrier films is tunable and fully transparent over the visible spectrum. The morphology and density of the barrier are shown to improve with the addition of a fluorine-based precursor. Thin-film perovskite solar cells with submicron coatings exhibited significant improvements in stability when exposed to light, heat, and moisture. X-ray diffraction measurements performed while heating showed the barrier film dramatically slows the formation of PbI2. When deposited on a flexible substrate, the barrier films exhibit no signs of cracking or delamination after 10,000 bending cycles on a 127 μm substrate with a bending radius of 1 cm.",

author = "Nicholas Rolston and Printz, {Adam D.} and Florian Hilt and Hovish, {Michael Q.} and Dauskardt, {Reinhold H.} and Karsten Bruning and Tassone, {Christopher J.}",

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AU - Bruning, Karsten

AU - Tassone, Christopher J.

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AB - We report on submicron organosilicate barrier films produced rapidly in ambient by a scalable spray plasma process for improved solar cell stability. The plasma is at a sufficiently low temperature to be compatible with flexible electronic devices. The thickness of the barrier films is tunable and fully transparent over the visible spectrum. The morphology and density of the barrier are shown to improve with the addition of a fluorine-based precursor. Thin-film perovskite solar cells with submicron coatings exhibited significant improvements in stability when exposed to light, heat, and moisture. X-ray diffraction measurements performed while heating showed the barrier film dramatically slows the formation of PbI2. When deposited on a flexible substrate, the barrier films exhibit no signs of cracking or delamination after 10,000 bending cycles on a 127 μm substrate with a bending radius of 1 cm.

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Spray Plasma Processing of Barrier Films Deposited in Air for Improved stability of Flexible Electronic Devices

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