SmartPrint Single-Mode Flexible Polymer Optical Interconnect for High Density Integrated Photonics

L. Jiang, A. Nishant, J. Frish, T. S. Kleine, L. Brusberg, R. Himmelhuber, K. J. Kim, J. Pyun, S. Pau, R. A. Norwood, T. L. Koch

Research output: Contribution to journalArticlepeer-review

6 Scopus citations

Abstract

This paper reports on the demonstration of a single-mode flexible polymer optical interconnect for efficiently and conveniently connecting integrated photonics chips to one another (chip-to-chip) and to optical printed circuit boards (chip-to-board). The interconnect uses a low-loss partially fluorinated refractive index contrast (RIC) polymer, referred to as poly(F-SBOC), that provides for direct patterning of the desired refractive index profiles into a slab waveguide consisting of poly(F-SBOC) and a flexible fluoropolymer film (Tefzel). Using a maskless lithography system, interconnects consisting of s-bends and tapers can be printed in situ into the poly(F-SBOC) material with no need for mechanical alignment. We demonstrate the efficacy of this approach by connecting two separate ion-exchange (IOX) glass waveguide chips, achieving fiber-to-fiber total insertion losses below 6dB in some cases, through the use of grayscale tapers that are written directly into the poly(F-SBOC) material.

Original languageEnglish (US)
Pages (from-to)3839-3844
Number of pages6
JournalJournal of Lightwave Technology
Volume40
Issue number12
DOIs
StatePublished - Jun 15 2022

Keywords

  • Chip scale packaging
  • integrated optics
  • optical polymer
  • optical waveguides
  • photonics
  • polymer films
  • silicon photonics

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics

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