Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian; Erin Mitchell

doi:10.1557/proc-767-f1.4

Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian, Erin Mitchell

Chemical and Environmental Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (ν) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that ν ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

Original language	English (US)
Pages (from-to)	21-26
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	767
DOIs	https://doi.org/10.1557/proc-767-f1.4
State	Published - 2003
Event	Chemical-Mechanical Planarization - San Francisco, CA, United States Duration: Apr 22 2003 → Apr 24 2003

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

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title = "Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization",

abstract = "The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (ν) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that ν ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).",

author = "Ara Philipossian and Erin Mitchell",

year = "2003",

doi = "10.1557/proc-767-f1.4",

language = "English (US)",

volume = "767",

pages = "21--26",

journal = "Materials Research Society Symposium - Proceedings",

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AU - Philipossian, Ara

AU - Mitchell, Erin

PY - 2003

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AB - The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (ν) of the CMP process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that ν ranges from 2 to 22 percent, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

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AN - SCOPUS:0242385502

SN - 0272-9172

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JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Chemical-Mechanical Planarization

Y2 - 22 April 2003 through 24 April 2003

ER -

Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Abstract

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