Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian; Erin Mitchell

doi:10.1143/jjap.42.7259

Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

Ara Philipossian, Erin Mitchell

Chemical and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

54 Scopus citations

Abstract

The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

Original language	English (US)
Pages (from-to)	7259-7264
Number of pages	6
Journal	Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
Volume	42
Issue number	12
DOIs	https://doi.org/10.1143/jjap.42.7259
State	Published - Dec 2003

Keywords

Chemical mechanical planarization (CMP) slurry utilization efficiency mean residence time coefficient of friction (COF) slurry flow rate pad surface texture

ASJC Scopus subject areas

General Engineering
General Physics and Astronomy

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10.1143/jjap.42.7259

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abstract = "The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).",

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AU - Mitchell, Erin

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AB - The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).

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Slurry Utilization Efficiency Studies in Chemical Mechanical Planarization

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Keywords

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