The residence time distribution of slurry in the pad-wafer interface was experimentally determined and used to calculate the slurry utilization efficiency (η) of the chemical mechanical planarization (CMP) process. Slurry utilization efficiency represents the percentage of slurry that actually participates in the polish by entering the region bounded between the wafer and the pad. Results show that η ranges from 2 to 22%, depending on operating conditions such as applied wafer pressure, relative pad wafer velocity, slurry flow rate and pad surface texture (i.e. type of pad grooving).
- Chemical mechanical planarization (CMP) slurry utilization efficiency mean residence time coefficient of friction (COF) slurry flow rate pad surface texture
ASJC Scopus subject areas
- Physics and Astronomy(all)