TY - GEN
T1 - Semiconductor-Free Field-Emission Nanoelectronics
T2 - 2019 International Vacuum Electronics Conference, IVEC 2019
AU - Nirantar, Shruti
AU - Ahmed, Taimur
AU - Ren, Guanghui
AU - Gutruf, Philipp
AU - Xu, Chengong
AU - Bhaskaran, Madhu
AU - Walia, Sumeet
AU - Sriram, Sharath
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/4
Y1 - 2019/4
N2 - We introduce a nann-scale, metal-based, field emission air channel transistor. Comparative analysis of tungsten, gold, and platinum based devices is presented. Devices are fabricated with electron beam lithography, achieving channel lengths less than 35 nm. With this small channel length, vacuum-like carrier transport is possible in air under room temperature and pressure. Source and drain electrodes have planar, symmetric, and tapered-sharp geometry. Due to this, devices operate in bi-direction with voltages \pmb{< 2}\mathbf{V} and current in nA range. The presented work enables a technology where metal-based switchable nanoelectronics can be created on any dielectric surface with low energy requirements.
AB - We introduce a nann-scale, metal-based, field emission air channel transistor. Comparative analysis of tungsten, gold, and platinum based devices is presented. Devices are fabricated with electron beam lithography, achieving channel lengths less than 35 nm. With this small channel length, vacuum-like carrier transport is possible in air under room temperature and pressure. Source and drain electrodes have planar, symmetric, and tapered-sharp geometry. Due to this, devices operate in bi-direction with voltages \pmb{< 2}\mathbf{V} and current in nA range. The presented work enables a technology where metal-based switchable nanoelectronics can be created on any dielectric surface with low energy requirements.
KW - Air-channel transistor
KW - field emission
KW - metal transistors
KW - semiconductor-free nanoelectronics
UR - http://www.scopus.com/inward/record.url?scp=85068961618&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85068961618&partnerID=8YFLogxK
U2 - 10.1109/IVEC.2019.8745106
DO - 10.1109/IVEC.2019.8745106
M3 - Conference contribution
AN - SCOPUS:85068961618
T3 - 2019 International Vacuum Electronics Conference, IVEC 2019
BT - 2019 International Vacuum Electronics Conference, IVEC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
Y2 - 28 April 2019 through 1 May 2019
ER -