TY - GEN
T1 - Screening study on frictional force analysis in relation to silica abrasive and slurry properties
AU - Zhuang, Yun
AU - Sampurno, Yasa Adi
AU - Sudargho, Fransisca
AU - Steward, Geoff
AU - Barthel, Herbert
AU - Mayer, Erwin Peter
AU - Gottschalk-Gaudig, Torsten
AU - Stintz, Michael
AU - Kaetzel, Uwe
AU - Nogowski, Andre
AU - Goldstein, Michael
AU - Philipossian, Ara
PY - 2007
Y1 - 2007
N2 - In this study, different amounts of standard fumed silica and fumed silica contaminated by coarse particles was added as powder to a standard copper CMP slurry to investigate their effects on large particle count, mean particle size, slurry viscosity, frictional force during wafer polishing, and copper removal rate. Standard silica powder consisted of the same particles used in the standard slurry while contaminated silica powder consisted of the same particles used in the standard slurry and additional large size particles. Large particle count analysis indicated that slurry dispersion itself generated large size particles in the slurries. The addition of 0.3% and 1% contaminated silica to the standard slurry caused significant increases in large particle count, and the mean particle size increased with the amount of contaminated silica added to the standard slurry. The slurry viscosity generally increased with the amount of standard and contaminated silica added to the standard slurry under the shear rate of 100 s-1. The standard slurry and slurries added with 0.3% and 1% contaminated silica were used to polish 200-mm blanket copper wafers on the APD-500 polisher that has the unique ability to measure frictional force in real time during polishing. The coefficient of friction increased with the amount of contaminated silica added to the standard slurry. In general, the removal rates for the slurry added with 1% contaminated silica were higher than the standard slurry and slurry added with 0.3% contaminated silica.
AB - In this study, different amounts of standard fumed silica and fumed silica contaminated by coarse particles was added as powder to a standard copper CMP slurry to investigate their effects on large particle count, mean particle size, slurry viscosity, frictional force during wafer polishing, and copper removal rate. Standard silica powder consisted of the same particles used in the standard slurry while contaminated silica powder consisted of the same particles used in the standard slurry and additional large size particles. Large particle count analysis indicated that slurry dispersion itself generated large size particles in the slurries. The addition of 0.3% and 1% contaminated silica to the standard slurry caused significant increases in large particle count, and the mean particle size increased with the amount of contaminated silica added to the standard slurry. The slurry viscosity generally increased with the amount of standard and contaminated silica added to the standard slurry under the shear rate of 100 s-1. The standard slurry and slurries added with 0.3% and 1% contaminated silica were used to polish 200-mm blanket copper wafers on the APD-500 polisher that has the unique ability to measure frictional force in real time during polishing. The coefficient of friction increased with the amount of contaminated silica added to the standard slurry. In general, the removal rates for the slurry added with 1% contaminated silica were higher than the standard slurry and slurry added with 0.3% contaminated silica.
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U2 - 10.1557/proc-0991-c08-03
DO - 10.1557/proc-0991-c08-03
M3 - Conference contribution
AN - SCOPUS:38549156046
SN - 9781558999510
T3 - Materials Research Society Symposium Proceedings
SP - 233
EP - 238
BT - 2007 MRS Spring Meeting
PB - Materials Research Society
T2 - 2007 MRS Spring Meeting
Y2 - 9 April 2007 through 13 April 2007
ER -