TY - JOUR
T1 - Removal of BTA adsorbed on Cu
T2 - A feasibility study using the quartz crystal microbalance with dissipation (QCMD) technique
AU - Wu, Bing
AU - Raghavan, Srini
N1 - Publisher Copyright:
© The Author(s) 2019.
PY - 2019
Y1 - 2019
N2 - In the formation of copper interconnects by Chemical Mechanical Polishing (CMP), benzotriazole (BTA) is used as a copper corrosion inhibitor in barrier CMP slurries and post-CMP cleaning formulations. Removal of BTA adsorbed on copper is important for the overall success of copper CMP process. In this study, adsorption/uptake of BTA and its removal from copper surface was investigated using a quartz crystal microbalance with dissipation monitoring capability (QCMD). Adsorption of BTA was carried out from a series of BTA solutions (20, 50, 100, 200 ppm) in tetramethylammonium hydroxide (TMAH) in the presence of hydrogen peroxide. Following the uptake step, removal of BTA by TMAH and acetohydroxamic acid (AHA) solutions maintained at pH 10 were studied in-situ. TMAH solutions remove some physisorbed BTA, while AHA is able to completely remove BTA.
AB - In the formation of copper interconnects by Chemical Mechanical Polishing (CMP), benzotriazole (BTA) is used as a copper corrosion inhibitor in barrier CMP slurries and post-CMP cleaning formulations. Removal of BTA adsorbed on copper is important for the overall success of copper CMP process. In this study, adsorption/uptake of BTA and its removal from copper surface was investigated using a quartz crystal microbalance with dissipation monitoring capability (QCMD). Adsorption of BTA was carried out from a series of BTA solutions (20, 50, 100, 200 ppm) in tetramethylammonium hydroxide (TMAH) in the presence of hydrogen peroxide. Following the uptake step, removal of BTA by TMAH and acetohydroxamic acid (AHA) solutions maintained at pH 10 were studied in-situ. TMAH solutions remove some physisorbed BTA, while AHA is able to completely remove BTA.
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U2 - 10.1149/2.0191905jjss
DO - 10.1149/2.0191905jjss
M3 - Article
AN - SCOPUS:85072011186
SN - 2162-8769
VL - 8
SP - P3114-P3117
JO - ECS Journal of Solid State Science and Technology
JF - ECS Journal of Solid State Science and Technology
IS - 5
ER -