Realization and application of a 111 million pixel backside-illuminated detector and camera

Norbert Zacharias, Bryan Dorland, Richard Bredthauer, Kasey Boggs, Greg Bredthauer, Mike Lesser

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Scopus citations


A full-wafer, 10,580 × 10,560 pixel (95 × 95 mm) CCD was designed and tested at Semiconductor Technology Associates (STA) with 9 μm. square pixels and 16 outputs. The chip was successfully fabricated in 2006 at DALSA and some performance results are presented here. This program was funded by the Office of Naval Research through a Small Business Innovation in Research (SBIR) program requested by the U.S. Naval Observatory for its next generation astrometric sky survey programs. Using Leach electronics, low read-noise output of the 111 million pixels requires 16 seconds at 0.9 MHz. Alternative electronics developed at STA allow readout at 20 MHz. Some modifications of the design to include anti-blooming features, a larger number of outputs, and use of p-channel material for space applications are discussed.

Original languageEnglish (US)
Title of host publicationFocal Plane Arrays for Space Telescopes III
StatePublished - 2007
EventFocal Plane Arrays for Space Telescopes III - San Diego, CA, United States
Duration: Aug 27 2007Aug 28 2007

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherFocal Plane Arrays for Space Telescopes III
Country/TerritoryUnited States
CitySan Diego, CA


  • All-sky-survey
  • Astrometry
  • Large-format CCD
  • Space situational awareness
  • Star tracker

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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