Abstract
In this paper, a full-wave layered-interconnect simulator (UA-FWLIS), which is capable of simulating EM effects in packaging-interconnect problems, is introduced. Standard integral-equation-based Method of Moment (MoM) techniques are employed in UA-FWLIS. However, instead of using standard time-consuming numerical integration techniques, we have analytically evaluated the MoM reaction elements, thereby greatly the computational efficiency of the simulator. This paper illustrates the application of the simulator by employing it in the studies of coupling in a stripline structure and S-parameters for an interconnect.
Original language | English (US) |
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Pages (from-to) | 347-356 |
Number of pages | 10 |
Journal | IEEE Transactions on Advanced Packaging |
Volume | 24 |
Issue number | 3 |
DOIs | |
State | Published - Aug 2001 |
Keywords
- Full-wave
- Integral equation
- Interconnects
- Method of moments
- Stripline
ASJC Scopus subject areas
- Electrical and Electronic Engineering