TY - GEN
T1 - Quantitative in-situ measurement of asperity compression during chemical mechanical planarization
AU - Gray, Caprice
AU - Apone, Daniel
AU - Rogers, Chris
AU - Manno, Vincent P.
AU - Barns, Chris
AU - Anjur, Sriram
AU - Philipossian, Ara
PY - 2005
Y1 - 2005
N2 - Modifications to the Dual Emission Laser Induced Fluorescence (DELIF) procedure used to collect images of the slurry layer between the polishing pad and wafer during Chemical Mechanical Planarization (CMP) have provided a means to attain instantaneous, high spatial resolution images of slurry film thickness. Presented here is a technique to determine the calibration factor that correlates image intensity to slurry film thickness. This presentation will discuss how to determine slurry layer shape near wafer features, pad roughness, and pad compressibility.
AB - Modifications to the Dual Emission Laser Induced Fluorescence (DELIF) procedure used to collect images of the slurry layer between the polishing pad and wafer during Chemical Mechanical Planarization (CMP) have provided a means to attain instantaneous, high spatial resolution images of slurry film thickness. Presented here is a technique to determine the calibration factor that correlates image intensity to slurry film thickness. This presentation will discuss how to determine slurry layer shape near wafer features, pad roughness, and pad compressibility.
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U2 - 10.1115/wtc2005-63805
DO - 10.1115/wtc2005-63805
M3 - Conference contribution
AN - SCOPUS:33144488596
SN - 0791842029
SN - 9780791842027
T3 - Proceedings of the World Tribology Congress III - 2005
SP - 425
EP - 426
BT - Proceedings of the World Tribology Congress III - 2005
PB - American Society of Mechanical Engineers
T2 - 2005 World Tribology Congress III
Y2 - 12 September 2005 through 16 September 2005
ER -