Progress in optimization of high-power, high-speed VCSEL arrays

James P. Rosprim, Li Wang, David Podva, Eric J.J. Martin, Preethi Dacha, Christopher J. Helms, Thomas Wilcox, Nein Yi Li, Richard F. Carson, Mial E. Warren, James A. Lott

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations


Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable optical power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. Performance of these devices is critically dependent both on the design of the VCSEL devices and the design of the sub-mount, which provides both the electrical and thermal contacts for the array. Recent results for modelling and optimization of the VCSELs and their corresponding sub-mounts are discussed.

Original languageEnglish (US)
Title of host publicationVertical-Cavity Surface-Emitting Lasers XXI
EditorsKent D. Choquette, Chun Lei
ISBN (Electronic)9781510606852
StatePublished - 2017
Externally publishedYes
EventVertical-Cavity Surface-Emitting Lasers XXI - San Francisco, United States
Duration: Feb 1 2017Feb 2 2017

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceVertical-Cavity Surface-Emitting Lasers XXI
Country/TerritoryUnited States
CitySan Francisco


  • Automotive temperature requirements
  • Integrated micro-lens
  • Laser array
  • Laser illumination
  • LiDAR
  • Principle stress
  • Shear stress

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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