Progress in high-power high-speed VCSEL arrays

Richard F. Carson, Mial E. Warren, Preethi Dacha, Thomas Wilcox, John G. Maynard, David J. Abell, Kirk J. Otis, James A. Lott

Research output: Chapter in Book/Report/Conference proceedingConference contribution

19 Scopus citations


Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.

Original languageEnglish (US)
Title of host publicationVertical-Cavity Surface-Emitting Lasers XX
EditorsKent D. Choquette, James K. Guenter
ISBN (Electronic)9781510600010
StatePublished - 2016
Externally publishedYes
EventVertical-Cavity Surface-Emitting Lasers XX - San Francisco, United States
Duration: Feb 17 2016Feb 18 2016

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X


ConferenceVertical-Cavity Surface-Emitting Lasers XX
Country/TerritoryUnited States
CitySan Francisco


  • automotive VCSEL applications
  • beam-shaping
  • integrated micro-lens
  • laser array
  • laser illumination
  • NIR illumination

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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