Prediction of thermal oxidation damage in polymers by using peridynamics

D. Behera, P. Roy, E. Madenci, S. Oterkus

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Design with polymers for long-term service under high temperature requires consideration of factors such as physical aging, chemical changes and thermo-oxidative degradation. Also, the coefficient of thermal expansion, glass transition temperature and fracture properties experience change such as decrease in fracture strain. The previous models in the literature are based on classical continuum mechanics (CCM) and solved using finite element methods for oxygen concentration, deformation, and failure prediction. This study presents a bond-based peridynamic modeling for coupled oxidation-diffusion and mechanical deformation of epoxy resins under isothermal condition. Its capability is demonstrated by considering a 977-2 epoxy resin and copper bi-material configuration under oxidation.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1457-1463
Number of pages7
ISBN (Electronic)9780738145235
DOIs
StatePublished - 2021
Externally publishedYes
Event71st IEEE Electronic Components and Technology Conference, ECTC 2021 - Virtual, Online, United States
Duration: Jun 1 2021Jul 4 2021

Publication series

NameProceedings - Electronic Components and Technology Conference
Volume2021-June
ISSN (Print)0569-5503

Conference

Conference71st IEEE Electronic Components and Technology Conference, ECTC 2021
Country/TerritoryUnited States
CityVirtual, Online
Period6/1/217/4/21

Keywords

  • Damage
  • Degradation
  • Oxidation
  • Peridynamics
  • Polymer
  • Thermal

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Prediction of thermal oxidation damage in polymers by using peridynamics'. Together they form a unique fingerprint.

Cite this