@inproceedings{d2c564f789514b3289d866ae82ebc14f,
title = "Prediction of thermal oxidation damage in polymers by using peridynamics",
abstract = "Design with polymers for long-term service under high temperature requires consideration of factors such as physical aging, chemical changes and thermo-oxidative degradation. Also, the coefficient of thermal expansion, glass transition temperature and fracture properties experience change such as decrease in fracture strain. The previous models in the literature are based on classical continuum mechanics (CCM) and solved using finite element methods for oxygen concentration, deformation, and failure prediction. This study presents a bond-based peridynamic modeling for coupled oxidation-diffusion and mechanical deformation of epoxy resins under isothermal condition. Its capability is demonstrated by considering a 977-2 epoxy resin and copper bi-material configuration under oxidation.",
keywords = "Damage, Degradation, Oxidation, Peridynamics, Polymer, Thermal",
author = "D. Behera and P. Roy and E. Madenci and S. Oterkus",
note = "Funding Information: This study was performed as part of the ongoing research at the MURI Center for Material Failure Prediction through Peridynamics at the University of Arizona (AFOSR Grant No. FA9550-14-1-0073) Publisher Copyright: {\textcopyright} 2021 IEEE; 71st IEEE Electronic Components and Technology Conference, ECTC 2021 ; Conference date: 01-06-2021 Through 04-07-2021",
year = "2021",
doi = "10.1109/ECTC32696.2021.00232",
language = "English (US)",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1457--1463",
booktitle = "Proceedings - IEEE 71st Electronic Components and Technology Conference, ECTC 2021",
}