Potential failure sites in a flip-chip package with and without underfill

E. Madenci; S. Shkarayev; R. Mahajan

doi:10.1115/1.2792643

Potential failure sites in a flip-chip package with and without underfill

E. Madenci, S. Shkarayev, R. Mahajan

Aerospace and Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

44 Scopus citations

Abstract

In this study, the effect of underfill on the level of stress concentrations is investigated and possible failure sites are identified by using a global/local finite element approach. The global elements" capture the exact singular behavior of the stresses near the geometric and material discontinuities. Application of the strain energy density criterion indicates the possible failure sites and how they shift due to the presence of underfill.

Original language	English (US)
Pages (from-to)	336-341
Number of pages	6
Journal	Journal of Electronic Packaging, Transactions of the ASME
Volume	120
Issue number	4
DOIs	https://doi.org/10.1115/1.2792643
State	Published - Dec 1998

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Mechanics of Materials
Computer Science Applications
Electrical and Electronic Engineering

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10.1115/1.2792643

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Potential failure sites in a flip-chip package with and without underfill

Abstract

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