Post assembly warpage prediction using refined zigzag element

Bahattin Kilic; Atila Barut; Erdogan Madenci

doi:10.1109/ECTC.2013.6575896

Post assembly warpage prediction using refined zigzag element

Bahattin Kilic, Atila Barut, Erdogan Madenci

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

Excessive warpage is one of the major concerns as the electronics industry is producing increasingly thinner dies and substrates; thus, requiring maximum dimensional stability. Consequently, a predictive capability for reducing warpage inis essential as part of the electronic device design process. In order to understand and identify the significant parameters causing excessive warpage, this study presents an approach based on finite element analysis using the refined zigzag element without requiring discretization in the thickness direction. However, it explicitly models the sequence of lamination that accounts for the topology of each layer in the substrate and its individual material properties.

Original language	English (US)
Title of host publication	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Pages	2255-2258
Number of pages	4
DOIs	https://doi.org/10.1109/ECTC.2013.6575896
State	Published - 2013
Event	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013 - Las Vegas, NV, United States Duration: May 28 2013 → May 31 2013

Publication series

Name	Proceedings - Electronic Components and Technology Conference
ISSN (Print)	0569-5503

Other

Other	2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013
Country/Territory	United States
City	Las Vegas, NV
Period	5/28/13 → 5/31/13

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2013.6575896

Cite this

Kilic, B, Barut, A & Madenci, E 2013, Post assembly warpage prediction using refined zigzag element. in 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013., 6575896, Proceedings - Electronic Components and Technology Conference, pp. 2255-2258, 2013 IEEE 63rd Electronic Components and Technology Conference, ECTC 2013, Las Vegas, NV, United States, 5/28/13. https://doi.org/10.1109/ECTC.2013.6575896

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Post assembly warpage prediction using refined zigzag element

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