Photonics for z-axis stacking of multi-chip modules

R. F. Carson, M. L. Lovejoy, K. L. Lear, M. E. Warren, O. Blum, P. K. Seigal, D. C. Craft, S. P. Kilcoyne, G. A. Patrizi

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations


Point-to-point interconnection of separable layers in vertically stacked multi-chip modules is enabled by surface-emitting lasers and corresponding low-power photoreceivers. For operation with minimum impact on electrical system design, the interconnects formed from such devices should operate at the system clock speed, and function in parallel without the use of multiplexing or encoding. These and other system-level requirements imply a unique set of design constraints. The device designs used for this work are based on highly efficient vertical-cavity surface-emitting lasers, connected to corresponding photoreceivers. This paper describes initial results of a two-layer breadboard interconnection demonstration based on these device and microlens technologies and discusses implications for further development.

Original languageEnglish (US)
Pages (from-to)125-126
Number of pages2
JournalConference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS
StatePublished - 1995
Externally publishedYes
EventProceedings of the 1995 8th Annual Meeting of the IEEE Lasers and Electro-Optics Society. Part 1 (of 2) - San Francisco, CA, USA
Duration: Oct 30 1995Nov 2 1995

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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