Peridynamic theory for simulation of failure mechanisms in electronic packages

Erkan Oterkus; Abigail Agwai; Ibrahim Guven; Erdogan Madenci

doi:10.1115/InterPACK2009-89107

Peridynamic theory for simulation of failure mechanisms in electronic packages

Erkan Oterkus
, Abigail Agwai
, Ibrahim Guven
, Erdogan Madenci

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.

Original language	English (US)
Title of host publication	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Pages	63-68
Number of pages	6
DOIs	https://doi.org/10.1115/InterPACK2009-89107
State	Published - 2010
Event	2009 ASME InterPack Conference, IPACK2009 - San Francisco, CA, United States Duration: Jul 19 2009 → Jul 23 2009

Publication series

Name	Proceedings of the ASME InterPack Conference 2009, IPACK2009
Volume	2

Other

Other	2009 ASME InterPack Conference, IPACK2009
Country/Territory	United States
City	San Francisco, CA
Period	7/19/09 → 7/23/09

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Access to Document

10.1115/InterPACK2009-89107

Cite this

Peridynamic theory for simulation of failure mechanisms in electronic packages. / Oterkus, Erkan; Agwai, Abigail; Guven, Ibrahim et al.
Proceedings of the ASME InterPack Conference 2009, IPACK2009. 2010. p. 63-68 (Proceedings of the ASME InterPack Conference 2009, IPACK2009; Vol. 2).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Oterkus, E, Agwai, A, Guven, I & Madenci, E 2010, Peridynamic theory for simulation of failure mechanisms in electronic packages. in Proceedings of the ASME InterPack Conference 2009, IPACK2009. Proceedings of the ASME InterPack Conference 2009, IPACK2009, vol. 2, pp. 63-68, 2009 ASME InterPack Conference, IPACK2009, San Francisco, CA, United States, 7/19/09. https://doi.org/10.1115/InterPACK2009-89107

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abstract = "Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.",

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PY - 2010

Y1 - 2010

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AB - Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.

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ER -

Peridynamic theory for simulation of failure mechanisms in electronic packages

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