TY - GEN
T1 - Peridynamic theory for simulation of failure mechanisms in electronic packages
AU - Oterkus, Erkan
AU - Agwai, Abigail
AU - Guven, Ibrahim
AU - Madenci, Erdogan
PY - 2010
Y1 - 2010
N2 - Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.
AB - Peridynamic theory is employed to investigate crack propagation in a multi-layer thin-film structure of electronic packages and in single layer graphene sheets. A brief description of this non-local theory is presented. Crack propagation path in patterned multilayer thin-film structures predicted by the peridynamic theory is compared against measurements from cross-sectional nanoindentation experiments. Single layer graphene sheet simulation results are compared to molecular dynamic simulations.
UR - http://www.scopus.com/inward/record.url?scp=77953957566&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77953957566&partnerID=8YFLogxK
U2 - 10.1115/InterPACK2009-89107
DO - 10.1115/InterPACK2009-89107
M3 - Conference contribution
AN - SCOPUS:77953957566
SN - 9780791843604
T3 - Proceedings of the ASME InterPack Conference 2009, IPACK2009
SP - 63
EP - 68
BT - Proceedings of the ASME InterPack Conference 2009, IPACK2009
T2 - 2009 ASME InterPack Conference, IPACK2009
Y2 - 19 July 2009 through 23 July 2009
ER -