@inproceedings{2aac5810c0834eb8864293dfc6b0487c,
title = "Peridynamic modeling of non-Fourier and non-Fickian diffusion in a finite element framework",
abstract = "This study presents a peridynamic (PD) modeling approach for non-Fourier heat conduction and non-Fickian moisture concentration in a finite element framework by considering MATRIX27 elements native to ANSYS. The thermal and moisture fields are coupled in the form of Dual-Phase-Lag (DPL) models to resolve the issue of propagation of thermal wave and mass of moisture with infinite speed. The nonlocal effects arising from thermal inertia, moisture inertia and microstructural interaction are included through the peridynamic form of the coupled field equations. The nonlocal PD theory involves integral equations without smoothness requirement of the field variable. Thermal and hygro bonds in PD enable exchange of thermal energy and moisture between nodes. The efficacy of this approach is established by considering heat conduction in a nanoscale metal film and a bar subjected to sudden pulse of thermal and moisture conditions.",
keywords = "ANSYS, Peridynamics, dual phase lag, moisture, non-Fickian, non-Fourier, thermal",
author = "Anicode, {S. V.K.} and E. Madenci",
note = "Funding Information: This study was performed as part of the ongoing research at the MURI Center for Material Failure Prediction through Peridynamics at the University of Arizona (AFOSR Grant No. FA9550-14-1-0073) Publisher Copyright: {\textcopyright} 2022 IEEE.; 72nd IEEE Electronic Components and Technology Conference, ECTC 2022 ; Conference date: 31-05-2022 Through 03-06-2022",
year = "2022",
doi = "10.1109/ECTC51906.2022.00047",
language = "English (US)",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "239--247",
booktitle = "Proceedings - IEEE 72nd Electronic Components and Technology Conference, ECTC 2022",
}