Peridynamic Direct Concentration Approach by Using ANSYS

S. W. Han; C. Diyaroglu; S. Oterkus; E. Madenci; E. Oterkus; Y. Hwang; H. Seol

doi:10.1109/ECTC.2016.251

Peridynamic Direct Concentration Approach by Using ANSYS

S. W. Han, C. Diyaroglu, S. Oterkus, E. Madenci, E. Oterkus, Y. Hwang, H. Seol

Aerospace and Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

12 Scopus citations

Abstract

Moisture can have damaging effects on electronic packages by inducing hygro-Thermo-mechanical stresses and vapor pressure. Commonly accepted wetness approach for indirect calculation of moisture concentration can yield unrealistic results. Therefore, a direct concentration approach becomes unavoidable. This study presents the Peridynamic Direct Concentration Approach (PDCA) and its implementation in ANSYS, a commercial finite element software. Numerical results show that PDCA provides accurate predictions, and removes the anomalies associated with the wetness approach. Moreover, ANSYS allows the utilization of implicit time integration resulting in significant computational advantages.

Original language	English (US)
Title of host publication	Proceedings - ECTC 2016
Subtitle of host publication	66th Electronic Components and Technology Conference
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	544-549
Number of pages	6
ISBN (Electronic)	9781509012039
DOIs	https://doi.org/10.1109/ECTC.2016.251
State	Published - Aug 16 2016
Event	66th IEEE Electronic Components and Technology Conference, ECTC 2016 - Las Vegas, United States Duration: May 31 2016 → Jun 3 2016

Publication series

Name	Proceedings - Electronic Components and Technology Conference
Volume	2016-August
ISSN (Print)	0569-5503

Other

Other	66th IEEE Electronic Components and Technology Conference, ECTC 2016
Country/Territory	United States
City	Las Vegas
Period	5/31/16 → 6/3/16

Keywords

Direct
Moisture
Peridynamics
Wetness

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/ECTC.2016.251

Cite this

Han, S. W., Diyaroglu, C., Oterkus, S., Madenci, E., Oterkus, E., Hwang, Y., & Seol, H. (2016). Peridynamic Direct Concentration Approach by Using ANSYS. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference (pp. 544-549). Article 7545484 (Proceedings - Electronic Components and Technology Conference; Vol. 2016-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2016.251

Peridynamic Direct Concentration Approach by Using ANSYS. / Han, S. W.; Diyaroglu, C.; Oterkus, S. et al.
Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., 2016. p. 544-549 7545484 (Proceedings - Electronic Components and Technology Conference; Vol. 2016-August).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Han, SW, Diyaroglu, C, Oterkus, S, Madenci, E, Oterkus, E, Hwang, Y & Seol, H 2016, Peridynamic Direct Concentration Approach by Using ANSYS. in Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference., 7545484, Proceedings - Electronic Components and Technology Conference, vol. 2016-August, Institute of Electrical and Electronics Engineers Inc., pp. 544-549, 66th IEEE Electronic Components and Technology Conference, ECTC 2016, Las Vegas, United States, 5/31/16. https://doi.org/10.1109/ECTC.2016.251

Han SW, Diyaroglu C, Oterkus S, Madenci E, Oterkus E, Hwang Y et al. Peridynamic Direct Concentration Approach by Using ANSYS. In Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc. 2016. p. 544-549. 7545484. (Proceedings - Electronic Components and Technology Conference). doi: 10.1109/ECTC.2016.251

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abstract = "Moisture can have damaging effects on electronic packages by inducing hygro-Thermo-mechanical stresses and vapor pressure. Commonly accepted wetness approach for indirect calculation of moisture concentration can yield unrealistic results. Therefore, a direct concentration approach becomes unavoidable. This study presents the Peridynamic Direct Concentration Approach (PDCA) and its implementation in ANSYS, a commercial finite element software. Numerical results show that PDCA provides accurate predictions, and removes the anomalies associated with the wetness approach. Moreover, ANSYS allows the utilization of implicit time integration resulting in significant computational advantages.",

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AB - Moisture can have damaging effects on electronic packages by inducing hygro-Thermo-mechanical stresses and vapor pressure. Commonly accepted wetness approach for indirect calculation of moisture concentration can yield unrealistic results. Therefore, a direct concentration approach becomes unavoidable. This study presents the Peridynamic Direct Concentration Approach (PDCA) and its implementation in ANSYS, a commercial finite element software. Numerical results show that PDCA provides accurate predictions, and removes the anomalies associated with the wetness approach. Moreover, ANSYS allows the utilization of implicit time integration resulting in significant computational advantages.

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Peridynamic Direct Concentration Approach by Using ANSYS

Abstract

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Keywords

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