Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation

  • Thomas R. Fanning
  • , John Maynard
  • , Christopher J. Helms
  • , Lei Yang
  • , David Podva
  • , Jeff Earls
  • , Jacob Lopez
  • , Michael Chung
  • , James Foresi
  • , Mial E. Warren
  • , Gianluca Bacchin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40°C to 125°C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina's selfhermetic flip-chip VCSEL are discußed. TriLumina's VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.

Original languageEnglish (US)
Title of host publicationVertical-Cavity Surface-Emitting Lasers XXIV
EditorsLuke A. Graham, Chun Lei
PublisherSPIE
ISBN (Electronic)9781510633636
DOIs
StatePublished - 2020
Externally publishedYes
EventVertical-Cavity Surface-Emitting Lasers XXIV 2020 - San Francisco, United States
Duration: Feb 5 2020Feb 6 2020

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11300
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceVertical-Cavity Surface-Emitting Lasers XXIV 2020
Country/TerritoryUnited States
CitySan Francisco
Period2/5/202/6/20

Keywords

  • AEC-Q102
  • Laser array
  • LiDAR
  • VCSEL
  • VCSEL array
  • VCSEL reliability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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