@inproceedings{bb165394786e4439910c548356c60d25,
title = "Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation",
abstract = "TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40°C to 125°C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina's selfhermetic flip-chip VCSEL are discu{\ss}ed. TriLumina's VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.",
keywords = "AEC-Q102, Laser array, LiDAR, VCSEL, VCSEL array, VCSEL reliability",
author = "Fanning, {Thomas R.} and John Maynard and Helms, {Christopher J.} and Lei Yang and David Podva and Jeff Earls and Jacob Lopez and Michael Chung and James Foresi and Warren, {Mial E.} and Gianluca Bacchin",
note = "Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; Vertical-Cavity Surface-Emitting Lasers XXIV 2020 ; Conference date: 05-02-2020 Through 06-02-2020",
year = "2020",
doi = "10.1117/12.2546689",
language = "English (US)",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Graham, {Luke A.} and Chun Lei",
booktitle = "Vertical-Cavity Surface-Emitting Lasers XXIV",
}