Performance, manufacturability, and qualification advances of high-power VCSEL arrays at TriLumina Corporation

Thomas R. Fanning, John Maynard, Christopher J. Helms, Lei Yang, David Podva, Jeff Earls, Jacob Lopez, Michael Chung, James Foresi, Mial E. Warren, Gianluca Bacchin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

TriLumina develops and manufactures flip-chip VCSEL technology used in 3D sensing applications that must meet automotive grade 1 temperature range (-40°C to 125°C) performance and be tested to high reliability standards and criteria (AEC-Q102). Advances in VCSEL efficiency, performance and automotive qualification of TriLumina's selfhermetic flip-chip VCSEL are discußed. TriLumina's VCSEL-on-board (VoB), surface-mount technology VCSEL is introduced.

Original languageEnglish (US)
Title of host publicationVertical-Cavity Surface-Emitting Lasers XXIV
EditorsLuke A. Graham, Chun Lei
PublisherSPIE
ISBN (Electronic)9781510633636
DOIs
StatePublished - 2020
Externally publishedYes
EventVertical-Cavity Surface-Emitting Lasers XXIV 2020 - San Francisco, United States
Duration: Feb 5 2020Feb 6 2020

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11300
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceVertical-Cavity Surface-Emitting Lasers XXIV 2020
Country/TerritoryUnited States
CitySan Francisco
Period2/5/202/6/20

Keywords

  • AEC-Q102
  • Laser array
  • LiDAR
  • VCSEL
  • VCSEL array
  • VCSEL reliability

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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