PCB-integrated metallic thermal micro-actuators

Eniko T. Enikov; Kalin Lazarov

doi:10.1016/S0924-4247(03)00065-7

PCB-integrated metallic thermal micro-actuators

Eniko T. Enikov, Kalin Lazarov

Research output: Contribution to journal › Article › peer-review

53 Scopus citations

Abstract

The development of thermal micro-actuators on printed circuit boards is described. The fabricated metal actuators are shown to have similar displacement characteristics when compared with silicon-based devices described in the literature. The actuators are benchmarked with respect to power consumption, stroke, and response time. It is further demonstrated that simple analytical estimates for the response time are in good agreement with the experimental measurements and finite element analysis. The thermal cooling transient times are captured using a two-step constant-current excitation method. The fabrication process and potential application areas of the developed device are also provided.

Original language	English (US)
Pages (from-to)	76-82
Number of pages	7
Journal	Sensors and Actuators, A: Physical
Volume	105
Issue number	1
DOIs	https://doi.org/10.1016/S0924-4247(03)00065-7
State	Published - Jun 15 2003

Keywords

MEMS
Micro-relay
Thermal micro-actuator
Thermal response time

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Instrumentation
Condensed Matter Physics
Surfaces, Coatings and Films
Metals and Alloys
Electrical and Electronic Engineering

Access to Document

10.1016/S0924-4247(03)00065-7

Cite this

@article{2356eae0738c4e7f976678451a4cb7f8,

title = "PCB-integrated metallic thermal micro-actuators",

abstract = "The development of thermal micro-actuators on printed circuit boards is described. The fabricated metal actuators are shown to have similar displacement characteristics when compared with silicon-based devices described in the literature. The actuators are benchmarked with respect to power consumption, stroke, and response time. It is further demonstrated that simple analytical estimates for the response time are in good agreement with the experimental measurements and finite element analysis. The thermal cooling transient times are captured using a two-step constant-current excitation method. The fabrication process and potential application areas of the developed device are also provided.",

keywords = "MEMS, Micro-relay, Thermal micro-actuator, Thermal response time",

author = "Enikov, {Eniko T.} and Kalin Lazarov",

year = "2003",

month = jun,

day = "15",

doi = "10.1016/S0924-4247(03)00065-7",

language = "English (US)",

volume = "105",

pages = "76--82",

journal = "Sensors and Actuators, A: Physical",

issn = "0924-4247",

publisher = "Elsevier B.V.",

number = "1",

}

TY - JOUR

T1 - PCB-integrated metallic thermal micro-actuators

AU - Enikov, Eniko T.

AU - Lazarov, Kalin

PY - 2003/6/15

Y1 - 2003/6/15

N2 - The development of thermal micro-actuators on printed circuit boards is described. The fabricated metal actuators are shown to have similar displacement characteristics when compared with silicon-based devices described in the literature. The actuators are benchmarked with respect to power consumption, stroke, and response time. It is further demonstrated that simple analytical estimates for the response time are in good agreement with the experimental measurements and finite element analysis. The thermal cooling transient times are captured using a two-step constant-current excitation method. The fabrication process and potential application areas of the developed device are also provided.

AB - The development of thermal micro-actuators on printed circuit boards is described. The fabricated metal actuators are shown to have similar displacement characteristics when compared with silicon-based devices described in the literature. The actuators are benchmarked with respect to power consumption, stroke, and response time. It is further demonstrated that simple analytical estimates for the response time are in good agreement with the experimental measurements and finite element analysis. The thermal cooling transient times are captured using a two-step constant-current excitation method. The fabrication process and potential application areas of the developed device are also provided.

KW - MEMS

KW - Micro-relay

KW - Thermal micro-actuator

KW - Thermal response time

UR - http://www.scopus.com/inward/record.url?scp=0037645760&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0037645760&partnerID=8YFLogxK

U2 - 10.1016/S0924-4247(03)00065-7

DO - 10.1016/S0924-4247(03)00065-7

M3 - Article

AN - SCOPUS:0037645760

SN - 0924-4247

VL - 105

SP - 76

EP - 82

JO - Sensors and Actuators, A: Physical

JF - Sensors and Actuators, A: Physical

IS - 1

ER -

PCB-integrated metallic thermal micro-actuators

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this