@inproceedings{33c51383ebe04ecf9d97c86e387106ab,
title = "Packaging issues for free-space interconnects at the board level",
abstract = "Many researchers have proposed free-space optical interconnects as an alternative to electrical and optical guided wave techniques for connecting electronic or optical processors. However, little discussion has been given to problems associated with system packaging. This paper provides an overview of several important issues in yjis area which must be solved prior to realizing free-space optical interconnect systems.",
author = "Kostuk, {Raymond K.}",
year = "1991",
language = "English (US)",
isbn = "0819406910",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "Publ by Int Soc for Optical Engineering",
pages = "72--80",
editor = "Neff, {John A.}",
booktitle = "Proceedings of SPIE - The International Society for Optical Engineering",
note = "Optical Enhancements to Computing Technology ; Conference date: 22-07-1991 Through 23-07-1991",
}