TY - GEN
T1 - Packaging design support environment - a simulation system for analysis of VLSI interconnects
AU - Whipple, T. D.
AU - Rozenblit, J. W.
AU - Prince, J. L.
AU - Palusinski, O. A.
PY - 1990
Y1 - 1990
N2 - An X-Windows-based simulation environment has been developed for the prediction of electrical characteristics of integrated circuit packaging structures. This program, called Packaging Design Support Environment (PDSE), applies simulation management techniques to drive several tools that make the calculations. Two tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with lossy dielectrics. A third tool uses these parameters to compute pulse response characteristics of multiple coupled, uniform, lossless transmission lines terminated at discrete points with R, L, and C elements. The design process in PDSE proceeds in three major phases: modeling, simulation, and evaluation. These processes are interactive and allow the designer to refine a design model, modify experiments, and apply various evaluation procedures.
AB - An X-Windows-based simulation environment has been developed for the prediction of electrical characteristics of integrated circuit packaging structures. This program, called Packaging Design Support Environment (PDSE), applies simulation management techniques to drive several tools that make the calculations. Two tools calculate inductance and capacitance for multiconductor, multidielectric, two-dimensional structures with lossy dielectrics. A third tool uses these parameters to compute pulse response characteristics of multiple coupled, uniform, lossless transmission lines terminated at discrete points with R, L, and C elements. The design process in PDSE proceeds in three major phases: modeling, simulation, and evaluation. These processes are interactive and allow the designer to refine a design model, modify experiments, and apply various evaluation procedures.
UR - http://www.scopus.com/inward/record.url?scp=0025641520&partnerID=8YFLogxK
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U2 - 10.1109/pccc.1990.101705
DO - 10.1109/pccc.1990.101705
M3 - Conference contribution
AN - SCOPUS:0025641520
SN - 0818620307
SN - 9780818620300
T3 - Conference Proceedings - Annual Phoenix Conference
SP - 828
EP - 831
BT - Conference Proceedings - Annual Phoenix Conference
PB - Publ by IEEE
T2 - Proceedings - Ninth Annual International Phoenix Conference on Computers and Communications
Y2 - 21 March 1990 through 23 March 1990
ER -